خمیر قلع سرنگی حجم 10cc محصول Mechanic

New technical support and unique chemical formula provide excellent wettability and ensure high reliability. The use of high-performance thixotropic agent can effectively prevent the collapse during printing and preheating, and the special flux ensures good printing and fine patterns. Tin solder paste has more advanced heat preservation technology, long-lasting adhesion, not easy to dry, and the adhesion time is more than 48 hours. The residue is colorless and transparent, does not affect the detection, no-washing and excellent cleaning performance. The product has good wettability, strong resistance to dryness, and a relatively long shelf life at room temperature.

It is suitable for mobile phone repair industry, computer digital repair industry, high-precision circuit board SMT welding, BGA process welding and so on!

Soldering

Suitable for :

Adapted to the mobile phone repair industry, computer digital service industries, High-precision circuit board soldering SMT, BGA soldering processes, etc.

Excellent wetting, high reliability.

Can effectively prevent the collapse of the printing and preheat,

Tack lasting, easy to dry, sticky time for more than 48 hours.

A colorless transparent, does not affect the test, fine-clean and cleaning performance.

Products wetting, anti-dry and strong, long shelf life at room temperature.

Type : XG-Z40

Alloy : Sn63/Pb37

Microns : 25-45um

Volume : 10cc