بطری 12 گرمی توپ لحیم کاری 0.45mm

گاهی نیز توپ‌های لحیم را تحت فشار سکه زنی می‌کنند تا با افزایش سطح تماس مقاومت آن‌ها افزایش یابد.

ساچمه لحیم به صورت گوی های کوچک قلع جهت مونتاژ و لحیمکاری انواع آی سی های BGA مورد استفاده قرار می گیرد.

این بطری حدود 25000 عددی توپ لحیم کاری 0.45mm یا ساچمه لحیم 0.45mm است قطر 0.45 میلی متری دارد و برای استفاده از این بال قلع 0.45mm نیاز به وان لحیم دارد.

In integrated circuit packaging, a solder ball, also a solder bump (offen referred to simply as "ball" or "bumps") is a ball of solder that provides the contact between the chip package and the printed circuit board, as well as between stacked packages in multichip modules; in the latter case, they may be referred to as microbumps (μbumps, ubumps), since they are usually significantly smaller than the former. The solder balls can be placed manually or by automated equipment, and are held in place with a tacky flux.

After the solder balls are used to attach an integrated circuit chip to a PCB, often the remaining air gap between them is underfilled with epoxy.

BGA ICs

Integrated Circuits

Solder ball no.: 25000

Tin ball diameter: 0.45mm